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Soldering Process For Components On Printed Circuit Cards

IP.com Disclosure Number: IPCOM000067822D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Crawford, DJ Druschel, WO [+details]

Abstract

At present, time wave soldering and fountain soldering processes are being used to solder components and circuit modules to multilayer printed circuit organic cards. These soldering processes produce severe stresses in the cards due to the localized heat. These stresses and deformations remain after cooling, and produce high forces on the pins of the components/modules. At present, when modules are soldered into cards (which are relatively thin and flimsy), the cards have a tendency to exert sufficient force upon cooling to pull the outer pins off the module. Because even larger modules are contemplated in the future, this is an important problem.