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Integrated Stacking Spacer For Metallized Ceramic Modules

IP.com Disclosure Number: IPCOM000067825D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Clark, BT Metreaud, CG [+details]

Abstract

Conventional metallized ceramic stacked modules rely on an array of discrete stacking pins to provide the structural and electrical interconnections between upper and lower substrates. Chips are mounted on the top surface of each substrate between the large input/output pin pads. Following the stacking process a protective enclosure is crimped over the assembly.