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Subcooled Flow Boiling With Flow Pattern Control Disclosure Number: IPCOM000067827D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

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Oktay, S Hwang, UP Pascuzzo, AL [+details]


The flow boiling system shown in Figs. 1 and 2 is designed to (1) control the flow pattern to reduce semiconductor chip temperature overheating, (2) provide uniform coolant inlet temperature to reduce possibility of temperature differentials in the system, and (3) decrease overall void fraction (ratio of volume of vapor to volume of liquid) which lowers pressure in the flow system.