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Controlled Environment Substrate Oven Disclosure Number: IPCOM000067835D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Caccoma, GA DeRobertis, J Leverett, TW Locke, CH Musits, B Wustrau, F [+details]


An oven is designed to provide a controlled environment by using nitrogen (or other gas) under slight pressure, to continuously flow through and purge the oven. Temperature uniformity is provided by preheating the nitrogen (or other gas), and also by separately controlling electric heating blankets built into the bottom and sides of the oven, and heating blankets built into the top plate. This controlled temperature/ atmosphere environment is necessary to effectively implement chip joining processes while maintaining the integrity of the substrate and previously joined chips.