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Laser Cutting Metal Through Quartz

IP.com Disclosure Number: IPCOM000067888D
Original Publication Date: 1979-Oct-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Aggarwal, BK Gandy, FD [+details]

Abstract

Fig. 1 shows a cross-sectional view of a prior structure wherein it is desired to cut a metal line by a laser melting technique. A semiconductor substrate 1 has deposited thereon an aluminum metal conductor 2 which is to be cut by means of the laser beam 3. The cutting is to take place after the structure has been completed with two layers of quartz 4 and 5 lying over the metal layer 2. It has been observed that if the laser beam 3 is transmitted through both layers of quartz 4 and 5 to cut the aluminum line 2, the quartz fractures along the lines 6 due to the rapid increase in temperature and uncontrollably splatters molten metal over the surface of the structure, thereby causing potential shorting problems.