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Bonding Procedure

IP.com Disclosure Number: IPCOM000068019D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Smathers, EW [+details]

Abstract

The procedure described herein and shown in the above drawing allows the precise bonding of two bodies by properly controlling the wicking of epoxy. The procedure requires the deposition of SiO shims or SiO(2) or similar deposition material onto one of the members. The shims can be laid down by well-known vacuum deposition techniques. The shims can be precisely controlled for thickness and require no further machine operations to define the thickness of the epoxy between the two members.