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Plasma Etch Rework Process

IP.com Disclosure Number: IPCOM000068026D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Owen, CJ Poliak, RM [+details]

Abstract

The encapsulation of modules containing integrated semiconductor chips with an organic polymer formulation is usually accompanied by some splashing of the polymer resin onto the module pins. When the module is cured to effect sealing, the polymer on the module pins contaminates them and interferes with their electrical function.