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Process For Forming Jumpers Disclosure Number: IPCOM000068028D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

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DeMarco, JL Sarnacki, FH [+details]


The described process is intended to form a solder bridge across an open area on the surface of a circuit board. Such a bridge is needed after independent board and component testing is finished. It should be noted that prematurely completing the connection formed by the solder bridge would unnecessarily complicate the testing.