Cap With Metallization Designed For Reflow Solder Attachment To A Substrate Seal Band
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20
Depicted in the drawing is a ceramic cap, metallized along the bottom of its walls to permit joining by solder reflow to a matching seal band provided on the surface of a ceramic substrate (not shown). To prevent the occurrence of solder bridging at internal corners, a preferential flow path is created by extending the metallization upward into the cap interior at each corner.