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Cap With Metallization Designed For Reflow Solder Attachment To A Substrate Seal Band Disclosure Number: IPCOM000068039D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Arnold, AJ Siwy, MJ [+details]


Depicted in the drawing is a ceramic cap, metallized along the bottom of its walls to permit joining by solder reflow to a matching seal band provided on the surface of a ceramic substrate (not shown). To prevent the occurrence of solder bridging at internal corners, a preferential flow path is created by extending the metallization upward into the cap interior at each corner.