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Flexible Probe Contact Disclosure Number: IPCOM000068043D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

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Humenik, JN [+details]


Future electronic packages are being designed to operate at increasingly higher frequencies. The testing of metallized substrates at these high frequencies requires test probes having low impedances. One way to lower the impedance of a test head is to make all of its electrical circuitry coaxial. This can be done, but results in a rigid head which cannot accommodate test substrates with uneven surfaces. The technique here relates to a contact element that will enable a coaxial lead probe head to be used on uneven substrates. The contact is not itself coaxial but its small size allows the use of coaxial test circuitry.