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The drawings depict a structure arranged for the efficient conduct of heat away from the chips in an integrated circuit module.
English (United States)
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Structure For The Removal Of Heat From An Integrated Circuit Module
The drawings depict a structure arranged for the efficient conduct of heat
away from the chips in an integrated circuit module.
Fig. 1 is a side view of the assembly sectioned to show the significant
components of the structure, and Fig. 2 is a view from above with a cutaway in
one corner to expose the features of the chip-joined substrate.
To establish a thermal path which is both effective and durable, individual
heat sinks are imbedded in the ceramic module cap at locations corresponding to
chip positions on the substrate. Each heat sink is provided with a disc of low
temperature melting alloy, and the top surface of each chip is metallized with a
pattern matching that of the disc. The ceramic cap, itself, is provided with a
metallized band on the base of the walls running around its perimeter, and the
substrate is produced with a similar band composed of high temperature melting
solder. By bringing cap and substrate together and applying sufficient heat while
holding them in alignment, the discs and band are caused to melt. As heat is
maintained, controlled collapse occurs as the discs assume a hemispherical
shape and bulge across the narrow gap of clearance to the chips to wet the
metallization provided on their top surfaces. During cooling, the high temperature
solder solidifies first to form the seal band and establish the height of the cap's
ceiling. Subsequently, the low temperature allo...