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Structure For The Removal Of Heat From An Integrated Circuit Module

IP.com Disclosure Number: IPCOM000068048D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Arnold, AJ [+details]

Abstract

The drawings depict a structure arranged for the efficient conduct of heat away from the chips in an integrated circuit module.