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Heat Sink Design Cooling Modules In A Forced Air Environment

IP.com Disclosure Number: IPCOM000068049D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Arnold, AJ Hardin, PW Shepheard, RG [+details]

Abstract

Shown is a heat sink designed to enhance the cooling capability of an integrated circuit module confined to a forced air environment.