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Shown is a heat sink designed to enhance the cooling capability of an integrated circuit module confined to a forced air environment.
English (United States)
This text was extracted from a PDF file.
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Heat Sink Design Cooling Modules In A Forced Air Environment
Shown is a heat sink designed to enhance the cooling capability of an
integrated circuit module confined to a forced air environment.
The basic heat sink consists of a block of thermally conductive material (such
as copper alloy) fabricated with a network of holes and grooves to provide
channels for the passage of air through the structure. This unit can be attached
to a module cap in a number of ways, but the preferable method would be by
brazing to metallized features provided on the surface of the cap. A collar, fitted
to the heat sink above the grooved channels, completes the assembly and
provides four columns for direct support of the block and for establishing a
module standoff distance upon seating the assembly into its printed circuit carrier
(not shown) at a subsequent level of construction. In particular instances the
collar could also serve as a divider to separate intake from exhaust regions when
mated into a conforming plenum arrangement.
In operation, the heat sink can function in various modes, with or without the
collar acting as a divider, with air driven at input, exhaust or both, and with air
directed from above (impingement) or from a side (serial) or sides.
This arrangement combines ease of heat sink fabrication (casting with
reliable attachment (brazing), structural integrity (ductile stanchions dampen
stresses at sink-to-cap interfaces) (outriggers independently support the heat