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Flexible Semiconductor Credit Card

IP.com Disclosure Number: IPCOM000068070D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Stuby, KP [+details]

Abstract

An electrically encodable credit card is disclosed which is a laminated composite containing a semiconductor wafer. The semiconductor wafer is composed of silicon which is ground and polished to a thickness of from 2 to 3 mils so that it has suitable flexible properties.