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Thin Film Plating Procedure Disclosure Number: IPCOM000068121D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Church, MA [+details]


To overcome the problem of variations and thicknesses of thin films on wafers. a matrix of vias 1 through an isolator layer 2 is employed. The distance between vias is equal, and all vias are tied together. Thus, all plating contacts would have equal resistances, resulting in uniform thickness of the plated thin films and wafers.