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This pattern is effective for testing semiconductor material for quality in the production of magnetic bubble devices, transistor circuitry, and the like.
English (United States)
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Detection Of Shorting Defects By Resistance Measurement
This pattern is effective for testing semiconductor material for quality in the
production of magnetic bubble devices, transistor circuitry, and the like.
Several test sites are established in a given wafer at the same time that the
electronic circuitry is laid down. After fabrication, the wafer is tested for quality by
applying the test corresponding to the test site (there being more than one type
of test site for a given wafer).
The test site shown is arranged for determining whether or not there are too
many areas that are sufficiently conducting as to destroy the electronic circuitry
laid down. The particular test site 10 under consideration comprises two
elongated electric conductors 12 and 14, with substantially identical
characteristics, arrayed in a serpentine fashion. One conductor is a standard,
and the other conductor is a test conductor. A simple resistance reading
between the pads S and C and another reading between the pads T and C
normally determine whether both conductors have the same resistance.
In addition, the test conductor 14 has a plurality of shorting links 16 that
nearly bridge open loops of the serpentine line to effect a test gap 18 of
dimension suitable for the particular test under consideration arranged between
the shorting link and the test line. Thus, if the test gap is arranged at a particular
spot of overconductivity, the shorting link will short out a whole loop of the tes...