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An abutment technique for producing a long array from silicon chips is described.
English (United States)
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Eutectic Welding Of Short Nozzle Arrays To Make Up Long Arrays
An abutment technique for producing a long array from silicon chips is
The long array is produced by making a plurality of short arrays of devices in
silicon and etching the edges along a suitable crystal plane. The edges are
covered with a gold film. The short arrays are aligned and heated to a suitable
temperature such as 370 degrees C so that, by a gold-silicon eutectic reaction,
the silicon chips are welded together.
An example is shown in which each short array 10 comprises a plurality of ink
jet nozzles comprising a pyramidally shaped opening 14 which is anisotropically
etched in silicon. The edges 16 of the short arrays are also anisotropically
etched along the (111) crystal plane so that the short arrays can be bonded by
eutectic welded joint 12 according to this technique, preserving the center to
center distance 18 between adjacent nozzles 20, 22 on the joined chips to
substantially the same tolerance as adjacent nozzles 22,24 on the same chip.
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