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Structure For Reducing The Number Of Printed Circuitry Lines And I/O Pins On A Bubble Chip Carrier

IP.com Disclosure Number: IPCOM000068136D
Original Publication Date: 1979-Nov-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Chapman, DW [+details]

Abstract

A structure consisting of a bubble chip, a semiconductor integrated circuit (IC) chip and a chip carrier to reduce the number of printed circuit conductor lines and input/output (I/O) pads on the chip carrier is shown in the edge-view drawing.