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A method for alignment of circuits on substrates is described. The system is illustrated in the figure.
English (United States)
This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
100% of the total text.
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Method For Aligning Circuits On Substrates
A method for alignment of circuits on substrates is described. The system is
illustrated in the figure.
X-rays 10 pass through the two substrates 12 and 14, but do not pass
through the solder spheres 16 thereon.
The transmitted X-rays 18 form an image on the fluorescent screen 20 which
is enhanced by an image intensifier 22. The reflected image from the half mirror
24 may be viewed without further process or, alternatively, the image transmitted
through the half mirror 24 may be monitored by a TV camera 26. The camera
output can be viewed on a monitoring screen 28 and/or recorded on a tape
Shadows are cast on the fluorescent screen 20 by the spheres 16 located on
the substrates 12 and 14. The substrates 12 and 14 may be brought into registry
by aligning the shadows cast by the spheres 16 on the substrate 12 with the
shadows cast by the spheres 16 on the substrate 14.
Heat is applied to the substrates 12 and 14 to melt the solder spheres 16 and
electrically connect the substrates 12 and 14. As the spheres 16 melt there is an
instantaneous charge in their image. This charge allows one to observe the
melting in real time and to minimize the processing time while insuring
connection of all elements of the circuit.
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