Browse Prior Art Database

Inorganic Solder Stop System

IP.com Disclosure Number: IPCOM000068227D
Original Publication Date: 1979-Dec-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
McBride, DG [+details]

Abstract

An inorganic solder stop-off material is prepared by mixing a metal complex such as Cr, Mo, W, Co acetylacetonate or other suitable metal with an organic vehicle in which the metal complex is soluble. The vehicle is selected to be photosensitive, if the desired deposition is to be done by photolithography.