Liquid Metal/Dendrite Connector
Original Publication Date: 1979-Dec-01
Included in the Prior Art Database: 2005-Feb-20
High density pad-to-pad connector systems are employed in a variety of applications, e.g., the interconnection of silicon chip pads to ceramic substrate pads. Liquid metal connector systems used for this purpose often are unreliable because of the insulative tarnish film that builds up on the liquid metal connector.