Browse Prior Art Database

Liquid Metal/Dendrite Connector

IP.com Disclosure Number: IPCOM000068236D
Original Publication Date: 1979-Dec-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Babuka, R Heath, RE Saxenmeyer, GJ Schultz, LK [+details]

Abstract

High density pad-to-pad connector systems are employed in a variety of applications, e.g., the interconnection of silicon chip pads to ceramic substrate pads. Liquid metal connector systems used for this purpose often are unreliable because of the insulative tarnish film that builds up on the liquid metal connector.