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Method For Formation And Attachment Of Pins To A Silicon Wafer

IP.com Disclosure Number: IPCOM000068361D
Original Publication Date: 1979-Dec-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Lahiri, SK [+details]

Abstract

Arrays of area contact pins and guide pins with shoulders are fabricated by electrical discharge machining (EDM), as shown in Figs. 1-3. In Fig. 1, a block 1 of copper or other suitable material is used on one electrode of a commercially available EDM system. The other electrode is a thin plate 2 having holes 3 for pin shoulders and holes 4 for guide pin shoulders disposed therein. Holes 3 and 4 are formed in plate 2 by well-known photolithographic masking and etching techniques.