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Means To Reduce Hillock Formation In Pb-In Alloy Films

IP.com Disclosure Number: IPCOM000068367D
Original Publication Date: 1979-Dec-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Murakami, M Tu, KN [+details]

Abstract

When a Pb-In alloy film on a substrate having a lower expansion coefficient (for example, a silicon wafer) is heated, compressive stress is introduced into the film as a result of the thermal mismatch between the film and the substrate. That stress can be partially relieved by the formation of hillocks in the film.