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Hall Magnetometer And Multilayered Ceramic Modules

IP.com Disclosure Number: IPCOM000068382D
Original Publication Date: 1979-Dec-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Bajorek, CH Thompson, DA [+details]

Abstract

Attainment of reliable and reworkable solder or braze joints on multilayer ceramic (MLC) metallurgy 9 on a substrate 8 in the drawing requires electroplating a specific thickness of Ni on the Mo paste-sintered metallurgy. The metallurgy 9 consists of a lower Mo layer above which are layers of Ni and Au. Electroplating processes are not sufficiently reproducible to guarantee desired thickness limits, and there is a need for a measurement technique to determine the Ni thickness on the abovementioned interfaces. Not only is it desirable to measure Ni thickness after plating, but also after diffusion of Ni into Mo and diffusion of a Au cladding into Ni (Au being used to enhance wettability to solders and/or brazes).