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Fast Method For On-Line Characterization Of Warped Silicon Wafers

IP.com Disclosure Number: IPCOM000068398D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Bronchard, JP Cholley, JF Gaillard, J Perrois, P [+details]

Abstract

Warped silicon wafers may result in poor manufacturing yields. Therefore, it is recommended that warped wafers be detected early in the process.