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Alignment Of Wafers In Test Apparatus

IP.com Disclosure Number: IPCOM000068403D
Original Publication Date: 1979-Sep-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Zschage, HH [+details]

Abstract

Prior to testing integrated circuit chips on a ceramic substrate, the contact pads of the substrate have to be aligned to hairpin probe needles of the test apparatus. An optical beam splitter arrangement is provided which can be moved to a position in which the pads and probes are accurately aligned to each other. This arrangement accurately pivots the beam splitter cube to the operating position, subsequently returning it to its home position.