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Wire Guide for Coil Winding Machine

IP.com Disclosure Number: IPCOM000068495D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kotrch, GS Miesch, ED [+details]

Abstract

In providing field coils wound around a bubble memory package, or the like, it is very important that the wires be maintained as straight and as flat as possible on the surface of the bubble memory package. It is also very necessary, when winding coils in the spaces between the pins of a pinned substrate, that the windings be properly located. Also, care must be taken when moving across or over a pin position into the next wiring channel, as indicated in Fig. 1.