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Enhanced Cooling of Components on a Card/Board Disclosure Number: IPCOM000068503D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Joshi, KC [+details]


Enhanced cooling of a number of components on a card or board is accomplished by thermally coupling the components to a common heat sink, which can be, for example, the frame of a small machine. This is especially advantageous when the components have varying amounts of heat dissipation.