Browse Prior Art Database

Double Stacked Bubble Memory Module

IP.com Disclosure Number: IPCOM000068508D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
McBride, DG [+details]

Abstract

In a bubble memory package, one configuration consists of a standard ceramic substrate having a double layer of input/output pins around the periphery of the substrate with the X and Y solenoid coils wrapped around the substrate. Therefore, the X and Y solenoid coils must be wrapped in the spaces between the input/output pins. This can cause a ripple in the rotational field uniformity in addition to potential electrical noise problems. Where these disturbances are unacceptable, a method for obtaining orthogonal coils can be accomplished without winding around the input/output pins, as illustrated in the attached figures.