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Double Stacked Bubble Memory Module Disclosure Number: IPCOM000068508D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

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McBride, DG [+details]


In a bubble memory package, one configuration consists of a standard ceramic substrate having a double layer of input/output pins around the periphery of the substrate with the X and Y solenoid coils wrapped around the substrate. Therefore, the X and Y solenoid coils must be wrapped in the spaces between the input/output pins. This can cause a ripple in the rotational field uniformity in addition to potential electrical noise problems. Where these disturbances are unacceptable, a method for obtaining orthogonal coils can be accomplished without winding around the input/output pins, as illustrated in the attached figures.