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Depositing Crack Free Heavy Electroless Nickel Coating

IP.com Disclosure Number: IPCOM000068520D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Haddad, MM Suierveld, J [+details]

Abstract

In semiconductor packaging, as well as other applications, it is frequently desirable to deposit electroless nickel layers. However, when the thickness of the nickel layers so deposited exceeds 125 microinches, stresses within the layer cause micro-cracking.