Depositing Crack Free Heavy Electroless Nickel Coating
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20
In semiconductor packaging, as well as other applications, it is frequently desirable to deposit electroless nickel layers. However, when the thickness of the nickel layers so deposited exceeds 125 microinches, stresses within the layer cause micro-cracking.