Browse Prior Art Database

Forming a Hermetic Bond in Semiconductor Package

IP.com Disclosure Number: IPCOM000068524D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Francis, JF Orosz, EM [+details]

Abstract

In hermetically sealed semiconductor packages it is a common practice to braze a frame to a ceramic substrate. The cap structure is then joined to the frame to complete the package. However, problems have been encountered in this procedure because excessive braze wetting of the frame can occur, which results in a hermetically defective seal.