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Semiconductor Package Structure Disclosure Number: IPCOM000068528D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

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Ecker, ME Olson, LT [+details]


This semiconductor package has a multilayer metallurgy system which embodies cluster vias and interleaved signal and power lines, which result in coplanar sequential power distribution and the achievement of greater density with lesser numbers of metallurgy layers.