Browse Prior Art Database

Semiconductor Package Structure

IP.com Disclosure Number: IPCOM000068528D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ecker, ME Olson, LT [+details]

Abstract

This semiconductor package has a multilayer metallurgy system which embodies cluster vias and interleaved signal and power lines, which result in coplanar sequential power distribution and the achievement of greater density with lesser numbers of metallurgy layers.