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Diaphragm Cooling for Devices Disclosure Number: IPCOM000068545D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Johnson, AH [+details]


Shown is a means for the cooling of semiconductor chips or devices 1, flip-chip mounted on a ceramic substrate 2. Cooling is effected by means of a coolant chamber 3 having a pleated yieldable diaphragm 4 having contact areas 5 for abutment with the back side of chips 1.