Browse Prior Art Database

Diaphragm Cooling for Devices

IP.com Disclosure Number: IPCOM000068545D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Johnson, AH [+details]

Abstract

Shown is a means for the cooling of semiconductor chips or devices 1, flip-chip mounted on a ceramic substrate 2. Cooling is effected by means of a coolant chamber 3 having a pleated yieldable diaphragm 4 having contact areas 5 for abutment with the back side of chips 1.