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Articulated Thermal Conductor for Semiconductor Chip Packages

IP.com Disclosure Number: IPCOM000068551D
Original Publication Date: 1978-Jan-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Gregor, LV Reeber, MD [+details]

Abstract

The above structure is an encapsulated cooling module wherein one or more semiconductor chips to be cooled are supported on a substrate portion of the module. Reference is made to the gas encapsulated cooling module disclosed in U. S. Patent 3,93,123.