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Thermal Isolation Technique for Heat Sensitive Components on a Printed Circuit Card

IP.com Disclosure Number: IPCOM000068652D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Hill, PW Karr, PC [+details]

Abstract

Increased component and circuit density on printed-circuit cards is established by making heat-sensitive components and heat-generating components compatible on the same printed-circuit card.