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Increased component and circuit density on printed-circuit cards is established by making heat-sensitive components and heat-generating components compatible on the same printed-circuit card.
English (United States)
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Thermal Isolation Technique for Heat Sensitive Components on a Printed
Increased component and circuit density on printed-circuit cards is
established by making heat-sensitive components and heat-generating
components compatible on the same printed-circuit card.
Thermal interaction between heat-generating and heat-sensitive components
is often a limit on the practical circuit density possible on a single printed-circuit
board. The most common method of reducing thermal interaction between heat-
generating and heat-sensitive devices is partitioning the circuitry such that the
two types of devices are at a distance from each other or carried on different
printed-circuit cards. Neither of the above circuit packaging methods enhances
component density or reduces the size and number of printed-circuit cards
required to package a circuit.
Referring to the figure, component density on a printed-circuit card 1 is
increased by providing a thermally isolated area which makes heat-generating
and heat-sensitive components compatible in the same card. Card 1 has a
substrate 2 supporting a laminated foil 3. The basic concept is the construction of
a thermal barrier 4 on the printed-circuit card between the area 3a, populated by
heat-generating devices, and area 3b, containing the heat-sensitive components.
By such a method one printed-circuit card can contain both heat-generating and
heat-sensitive devices with significantly reduced heating interaction between the
A low thermal resistance path in the form of a continuous metal foil laminated
onto one surface of a printed-circuit card effectively dissipates the heat from a
heat-generating component by conduction and, to some extent, radiation.
Components associated with supporting circuitry of the heat-generating device
located near the heat source would necessarily be mounted on a card surface
heated by conduction. To avoid this thermal interaction, the sens...