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Surface Preparation for Additive Plating

IP.com Disclosure Number: IPCOM000068661D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Acitelli, MA Alpaugh, WA Woods, JJ [+details]

Abstract

It is known that a suitable surface for additive plating can be obtained by laminating copper or aluminum foil onto the surface and then etching away the copper or aluminum.