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It is known that a suitable surface for additive plating can be obtained by laminating copper or aluminum foil onto the surface and then etching away the copper or aluminum.
English (United States)
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Surface Preparation for Additive Plating
It is known that a suitable surface for additive plating can be obtained by
laminating copper or aluminum foil onto the surface and then etching away the
copper or aluminum.
An improved surface can be obtained by coating the copper or aluminum with
an adhesive prior to laminating it onto the substrate. A suitable adhesive is a 0.2
to 0.3 mil film of a phenolic Buna N adhesive. The process would consist of the
following steps: 1. Coat an aluminum or copper foil with adhesive. 2. Laminate
the coated foil onto a substrate, the adhesive layer being positioned between the
foil and the substrate. 3. Etch away the aluminum or copper layer. 4. Additively
plate the desired circuit pattern onto the substrate.
Utilizing the above process, a high bond strength can be achieved.
As an alternative to applying a layer of adhesive to the foil, one can
chemically etch (utilizing solvents) or mechanically abrade (e.g., sand blasting)
the surface of the metal foil.