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Water Soluble Flux for Lead/Indium Solder Joints

IP.com Disclosure Number: IPCOM000068663D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Schuessler, PW [+details]

Abstract

A water-soluble flux composition for lead/indium solder joints includes: Wt. % polyethylene/polypropylene oxide derivatives of trimethylolpropane 50 N,N,N',N' / tetrakis (2/hydroypropyl)/ ethylenediamine 5 polyoxyethylene (10) soyamine 5 polyethylene/polypropylene oxide derivatives of ethylenediamine 40