Browse Prior Art Database

Low Cost Integrated Circuit

IP.com Disclosure Number: IPCOM000068667D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Gedney, RW Werbizky, GG [+details]

Abstract

The electronic package shown above has a plurality of integrated circuit chips, such as 15 and 20 (the only two shown), mounted on a metallized ceramic substrate 10, which is, in turn, mounted on a printed-circuit board 50. Metallized ceramic substrate 10 is connected to a printed-circuit board 50 by pluggable connectors 51. Connectors 51 are conventional spring-to-metal, which are plated with gold or platinum to enhance reliability. All four edges of the ceramic substrate 10 can be used to provide room for a large number of connectors 51. In order to create mechanical balance, it is preferable to use at least two edges of each substrate 10. If the design does not require a large number of connections, a dummy connector can be used for load balance.