Browse Prior Art Database

Multiple I/O Pin Terminations for Packaging

IP.com Disclosure Number: IPCOM000068669D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Joshi, KC McBride, DG Spaight, RN [+details]

Abstract

The design, fabrication and attachment of a multipin/connector element can be incorporated between various levels of packaging to provide a multifold increase in module input/output (I/O) count for a given pin count. For example, a four times increase can be accomplished, as shown in the figures. The basic pin cross-section (Fig. 1) includes a plurality of conductors 11 which are drawn in conjunction with the plastic interior 13 of the pin base. Thereafter, the device can be sliced into individual pins.