Snap In Substrate Holder for Coil Winder
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20
Holding device 10 allows an operator quickly to load a bubble memory module 7, i.e., its ceramic pinned substrate 7a and spacer 7b, into an automatic coil wire winding machine (not shown). The module 7 to be wired is positioned by placing it between locating points A, B of two-mirror image identical housings, 1A, 1B, shafts 8 of which are positioned into the associated wire winding machine chucks. In their OPEN or module-unloaded position, clamps 2 allow module 7 to be positioned correctly. A slight pressure downward on module 7 causes clamps 2 to pivot about pins 3 and activate links 6, which in turn pivot about pins 4 (Fig. 2). This action positions springs 5 to hold links 6 in a locked position. As a result, clamps 2 are now in their CLOSED position, and securely hold module 7 during the subsequent coil winding operation.