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High speed, high pressure polishing of workpieces, such as semiconductor wafers, is accomplished in two steps using a single polishing wheel machine.
English (United States)
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Wafer Polishing Process
High speed, high pressure polishing of workpieces, such as semiconductor
wafers, is accomplished in two steps using a single polishing wheel machine.
Polishing plate 1 (Fig. 1) is mounted for rotation with shaft 2. Plate 2 carries
an annular shaped prepolish pad 3 and a circular final polishing pad 4 in the
center. Workpiece 5 is mounted on quill 6 which rotates workpiece 5 in contact
with pad 3 (Fig. 2). After the initial fast, prepolishing is completed, the quill and
workpiece are moved to the center final polishing pad 4 for a brief gentle final
polish (Fig. 3). Wafers can be polished in 3-4 minutes with overall material
removal rates on pad 3 of about 60 mil/hr and on pad 4 of about 3-4 mil/hr.
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