Browse Prior Art Database

Wafer Polishing Process

IP.com Disclosure Number: IPCOM000068681D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Hause, JA Irish, TH Mendel, E [+details]

Abstract

High speed, high pressure polishing of workpieces, such as semiconductor wafers, is accomplished in two steps using a single polishing wheel machine.