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Spring Loaded Module Connectors for Mounting an Array of Modules on Circuit Board Disclosure Number: IPCOM000068687D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Moran, KP Pascuzzo, AL Yacavonis, RA [+details]


One of the major difficulties encountered when removing heat from a device or source via conduction cooling is to maintain a minimum contact resistance (dry interface) between the source and sink. The thermal interface contact resistance is a function of surface finish, flatness and pressure between the mating surfaces. The greater the pressure, the smaller the contact resistance. The difficulties are magnified in structures having many heat sources and a single sink; the problem, then, is to provide good thermal contact between all these sources and the sink. In the packaging of integrated circuit modules on a board in contact with a cooling member, such as a cold plate, a traditional method of minimizing thorough contact resistance has been to have each device, i.e.