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Technique for Controlled Paste Filled Via Surface for Preventing Paste Transfer at Lamination of MLC Greensheets

IP.com Disclosure Number: IPCOM000068689D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Desai, KS [+details]

Abstract

If in the fabrication of multilayer ceramic (MLC) substrates, ceramic greensheets are punched to form via holes which are subsequently filled with conductive paste and a pattern deposited on the top surface. During the screening operation, it is conventional to support the green ceramic sheet on a layer of impervious material to prevent the conductive paste from being forced through the holes into contact with the apparatus. The backing sheet is subsequently removed and the greensheets laminated.