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Selectively Electroplating Pad Terminals on an MLC Substrate

IP.com Disclosure Number: IPCOM000068691D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Haddad, MM [+details]

Abstract

In this technique a substrate 10 has contact pads 12 on the top surface that are to be electroplated to build up a thick layer of metal, for example, gold. Pads 14 and 16 are not to be electroplated. Pin pads 18 on the bottom surface will be used to establish electrical contact to pads 12 during the electroplating process. In order to make certain that an electrical contact exists between pads 18 and 12, it is desirable to interconnect pads 14 and 16. For example, an internal conductive line 20 may connect pad 14 to 12 but not contain an interconnection to pad 18. However, pad 16 contains an internal line 22 connected to pad 18. It can be seen that an electrical connection can be obtained to pads 12 from pads 18 if pads 14 and 16 are interconnected.