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Sealant for Semiconductor Package Disclosure Number: IPCOM000068693D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Rifkin, AA Schiller, JM Turetzky, MN [+details]


In semiconductor packages an enclosure is provided which is joined to a ceramic substrate. If the enclosure is to be hermetically sealed, the joint between the metal enclosure and the ceramic substrate must be hermetic in nature and sufficiently strong to withstand the stresses imposed on the structure.