Browse Prior Art Database

Sealant for Semiconductor Package

IP.com Disclosure Number: IPCOM000068693D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Rifkin, AA Schiller, JM Turetzky, MN [+details]

Abstract

In semiconductor packages an enclosure is provided which is joined to a ceramic substrate. If the enclosure is to be hermetically sealed, the joint between the metal enclosure and the ceramic substrate must be hermetic in nature and sufficiently strong to withstand the stresses imposed on the structure.