Guillotine Test for Counting the Edge Damages on Silicon Wafers
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20
The highly integrated designs that semiconductor manufacturers are producing today require very perfect silicon wafers; this is obtained now with improved polishing techniques. However, it was observed, on the production line, that those surfaces do not remain perfect very long and that right after the first oxidation, the wafers are covered by a nonnegligible number of small particles on the order of a few microns.