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This article describes a technique which avoids the time-consuming manual, fine adjustment of many contact needles in probe heads used to test LSI circuits and achieves a higher degree of accuracy.
English (United States)
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Multiple Probe Head With Photolithographic Accuracy
This article describes a technique which avoids the time-consuming manual,
fine adjustment of many contact needles in probe heads used to test LSI circuits
and achieves a higher degree of accuracy.
After assembly of the probe head, the tips of all contact needles 1 are ground
off in one plane 2. Thus, alignment of the needles in the vertical direction Z is
achieved. Then the ground surfaces of the needles are coated with photoresist 3. The photoresist is exposed through mask 4 in such a manner that it is cured
in areas 5 which are accurately aligned to the corresponding contact pads 6 on
the chip. In a subsequent etch step, those areas of the needle tips which are
covered with cured photoresist are recessed, thus leaving the reshaped needle
tips accurately adjusted in the horizontal X-Y direction.
Concurrently with the etching of the probe tips, alignment marks are
engraved on a transparent plane (not shown) mounted on the probe head.
These marks can be used to accurately position the probe head with respect to
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