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A punchthrough welding phenomenon can be used to make good connections between two layers of metal.
English (United States)
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Personalization of Programmable Logic Array Using Welding Technique
A punchthrough welding phenomenon can be used to make good
connections between two layers of metal.
As shown in the figures, two layers of metal 10 and 12, separated by a thin
layer of aluminum oxide (Al O ) 14 on the monolithic circuit chip, can be welded
together using a welding probe 16 to simultaneously apply pressure and voltage
to the two layers 10 and 12. The use of high pressure or the high voltage applied
by the probe is not able to accomplish punchthrough welding.
The high pressure of the probe associated with the high voltage applied to
the probe caused the field density across the Al(2)O(3) to increase rapidly. As a
result, the thin Al(2)O(3) breaks down, and the punchthrough effect causes the
second-level metal to migrate through the hole and shorts to the first-level pad,
as shown in Fig. 2.
The welding technique described above, could be employed to personalize
programmable logic array (PLA) chips. The size of the target area required
depends upon the size of the probe tip (0.1 mil to 1.0 mil). During the
personalization of the PLA, the input lines 12 could be tied to a power supply,
and the probe could be tied to ground. A simple circuit can be built to test the
welding contact resistance at the same time that the array is personalized.
In order to have a thin layer of oxide, e.g., Al(2)O(3) under the welding target
(Fig. 1), an additional mask might be needed to prevent the oxide...