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A jet of cooling fluid must be isolated from a semiconductor chip to prevent chemical interaction, mechanical chip loading and erosion/ corrosion problems.
English (United States)
This text was extracted from a PDF file.
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This is the abbreviated version, containing approximately
57% of the total text.
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Jet Cooling Cup for Cooling Semiconductor Devices
A jet of cooling fluid must be isolated from a semiconductor chip to prevent
chemical interaction, mechanical chip loading and erosion/ corrosion problems.
The isolation is obtained by utilizing the jet in conjunction with a cup 10
constructed to optimize the fluid motion and heat transfer, as can be best seen in
Fig. 3. The cup 10 is mounted to or integral with a spring 12 of different material
providing a low-compliance contact between the chip 14 and the cup bottom.
This arrangement is capable of absorbing parallelism and longitudinal chip-
location errors from the reference plane of the cup.
The cup 10 cross section shown in Fig. 3 is constructed to enhance laminar
flow by the appropriate choice of surface finish, diameter and length so that fluid
from the jet tube 16 forms a stable layer (axisymmetric) across the bottom of the
cup and up the side walls to the plane of the cup flange 18. The cup bottom 20 is
constructed of an erosion-resistant bottom section of a material, such as BeO
(beryllium oxide) or some other having good thermal conductivity and erosion
resistance. The side wall is extended from the base by techniques such as
electro-deposition or sputtering. The wall material, such as copper, is chosen to
enhance the fin effect of the tube, and may be inwardly ribbed to enhance
A spring bellows 12 extends from the cup flange to a seating plane, as shown
in Fig. 3, to relieve the mechanica...