Browse Prior Art Database

Centerless Ceramic Package with Directly Connected Heat Sink

IP.com Disclosure Number: IPCOM000068751D
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Ronkese, BJ [+details]

Abstract

The standard ceramic packages, such as the dual in-line package (DIP) have the back side of the chip attached directly to the ceramic package. The heat sink is attached to the other side of the ceramic package. The heat transfer path is from the back of the chip through the ceramic of the package into the heat sink. With higher power chips the thermal resistance of the ceramic provides a sufficiently high resistance so that it becomes a problem.