Selective Staining Process to Detect Silica Contamination on Magnetic Bubble Substrates
Original Publication Date: 1978-Feb-01
Included in the Prior Art Database: 2005-Feb-20
In preparing chips for use in bubble memory devices it is common practice to polish the Gd(3) Ga(5)O(12) substrate wafer with micron-sized silica particles. It is not easy to remove all of these silica particles after the polishing step has been completed. It is difficult to detect these particles that remain on the wafer because they are colorless. If these particles are not removed from the wafer, they cause defects in the epitaxial film that is subsequently deposited on the wafer.